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| 貨號 | BERGQUIST GAP FILLER TGF 2000 |
| 品牌 | BERGQUIST GAP FILLER TGF 2000 |
| 工作溫度 | -73°C to 260°C |
| 執(zhí)行標(biāo)準(zhǔn) | |
| 活性使用期 | |
| 包裝規(guī)格 | 支 |
| CAS編號 | |
| 別名 | BERGQUIST GAP FILLER TGF 2000 |
| 有效物質(zhì)≥ | |
| 固化方式 | |
| 有效期 |
BERGQUIST GAP FILLER TGF 2000 is a two-component, thermally conductive, silicone-based liquid gap filler engineered for high-reliability aerospace, aviation, defence, OEM, and MRO applications. The material cures at room temperature, with optional heat-accelerated curing to support production flexibility. Its low modulus and excellent compression set enable reliable stress relief across sensitive electronic assemblies, while its chemical and mechanical stability at both low and high temperatures makes it suitable for harsh operational environments.
This ultra-conformable gap filler provides a thermal conductivity of 2 W/m-K and maintains consistent performance across a wide temperature range from -60°C to 200°C. These properties make it an effective choice for thermal management in advanced aircraft systems, avionics, power electronics, and other mission-critical assemblies requiring efficient heat dissipation and long-term durability.
Key Features:
Ultra conformable material for excellent surface wet-out
Thermal conductivity: 2 W/m-K
Operational temperature range: -60°C to 200°C
Room temperature or accelerated heat curing
Low modulus formulation with reliable compression set performance
High chemical and mechanical stability for demanding aerospace environments
